Incorporated in 1993, Cyient DLM Limited provides Electronic Manufacturing Services (EMS) and solutions.
Electronic Manufacturing Services are provided by the company as Build to Print (“B2P”) and Build to Specification (“B2S”). Clients submit the design for the product for which the company delivers agile and flexible manufacturing services in B2P solutions. Furthermore, B2S services entail designing and manufacturing the appropriate product based on the requirements provided by the client.
Cyient DLM IPO Details
| IPO Date | Jun 27, 2023 to Jun 30, 2023 |
| Listing Date | [.] |
| Face Value | Rs 10 per share |
| Price | [.] to [.] per share |
| Lot Size | |
| Total Issue Size | [.] shares (aggregating up to Rs 592.00 Cr) |
| Fresh Issue | [.] shares (aggregating up to Rs 592.00 Cr) |
| Issue Type | Book Built Issue IPO |
| Listing At | BSE, NSE |
| Share holding pre issue | 56,941,471 |
Cyient DLM IPO Timetable (Tentative)
Cyient DLM IPO opens on Jun 27, 2023, and closes on Jun 30, 2023.
| Event | Tentative Date |
|---|---|
| Opening Date | Tuesday, 27 June 2023 |
| Closing Date | Friday, 30 June 2023 |
| Basis of Allotment | Wednesday, 5 July 2023 |
| Initiation of Refunds | Thursday, 6 July 2023 |
| Credit of Shares to Demat | Friday, 7 July 2023 |
| Listing Date | Monday, 10 July 2023 |
| Cut-off time for UPI mandate confirmation | 5 PM on Jun 30, 2023 |
Cyient DLM IPO Reservation
| QIB Shares Offered | Not less than 75.00% of the Net offer |
| NII (HNI) Shares Offered | Not more than 15.00% of the Offer |
| Retail Shares Offered | Not more than 10.00% of the Offer |
